从架构上来讲，SIP是将多种功能芯片，包括处理器、存储器、接口等功能芯片集成在一个封装内，从而实现一个基本完整的功能。与SOC（片上系统）相对应。不同的是系统级封装是采用不同芯片进行并排或叠加的封装方式。

SIP is a combination of multiple active electronic components of different functionality, assembled into a single unit, that provides multiple functions associated with a system or sub-system. A SIP may optionally contain passives, MEMS, optical components and other packages and devices.
HSCC Technology designs and producing System in package moduleand MCM (multi-chip module).Depends on the specific requirements in reliability and performance, HSCC Technology offers competitiveness and differentiation products to satisfy their need.